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Wire Bonding Guidelines | AmTech Microelectronics, Inc.

Website URL: http://amtechmicro.com/wire-bonding-guidelines/

Category: OEM ODM for Telecommunication Products

Wire Bonding Processes. There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding.

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